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HOYA CORPORATION (JP:7741)
TSE/TYO:7741
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HOYA (7741) Dividend Date & History

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Dividend Data

Last Ex-Dividend Date
Sep 27, 2024
Payment date​
Nov 29, 2024
Dividend Amount Per Share
¥45
Annually
Dividend Yield
0.61%
Sector: Healthcare
Sector Average: 1.664%
Payout Ratio
12.19%
Dividend Growth​
9 months
Since 2024
Last 3 Months

Dividend Amount Per Share​

7741 Dividend Yield Range

7741 Dividend History

Ex-Date
Record Date
Payment Date
Frequency
Declaration Date
Amount
Sep 27, 2024Sep 30, 2024Nov 29, 2024AnnuallyMay 15, 2024¥45.00
Mar 28, 2024Mar 31, 2024Jun 10, 2024AnnuallyMay 08, 2023¥66.65
Sep 28, 2023Sep 30, 2023Nov 30, 2023AnnuallyMay 08, 2023¥45.00
Mar 30, 2023Mar 31, 2023Jun 01, 2023AnnuallyDec 16, 2022¥65.00
Sep 29, 2022Sep 30, 2022Nov 30, 2022AnnuallyJun 17, 2022¥45.00
The table shows HOYA CORPORATION’s dividend history, including amount per share, payout frequency, declaration, record, and payment dates.

FAQ

Does HOYA CORPORATION pay dividends?
Yes, JP:7741 has paid a dividend within the past 12 months.
    How much is HOYA CORPORATION's dividend?
    JP:7741 pays a dividend of ¥45 per share. JP:7741's annual dividend yield is 0.61%.
      When is HOYA CORPORATION ex-dividend date?
      HOYA's previous ex-dividend date was on Sep 27, 2024. HOYA shareholders who own JP:7741 stock before this date received HOYA's last dividend payment of ¥45 per share on Nov 29, 2024. JP:7741's next ex-dividend date has not been announced yet.
        When is HOYA CORPORATION dividend payment date?
        HOYA’s next quarterly payment date is on Nov 29, 2024, when HOYA shareholders who owned JP:7741 shares before Sep 27, 2024 received a dividend payment of ¥45 per share. Add JP:7741 to your watchlist to be reminded of JP:7741's next dividend payment.
          Does HOYA CORPORATION have sufficient earnings to cover their dividend?
          Yes, JP:7741's past year earnings per share was ¥559.78, and their annual dividend per share is ¥68.72. JP:7741's dividend payout ratio is 12.19% (¥68.72/¥559.78) which is sustainable.
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