The table shows LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H’s dividend history, including amount per share, payout frequency, declaration, record, and payment dates.
FAQ
Does LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H pay dividends?
Yes, HK:2291 has paid a dividend within the past 12 months.
How much is LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H's dividend?
HK:2291 pays a dividend of HK$0.62 per share. HK:2291's annual dividend yield is 3.58%.
When is LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H ex-dividend date?
LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H's previous ex-dividend date was on May 28, 2024. LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H shareholders who own HK:2291 stock before this date received LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H's last dividend payment of HK$0.62 per share on Jul 22, 2024. HK:2291's next ex-dividend date has not been announced yet.
When is LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H dividend payment date?
LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H’s next quarterly payment date is on Jul 22, 2024, when LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H shareholders who owned HK:2291 shares before May 28, 2024 received a dividend payment of HK$0.62 per share. Add HK:2291 to your watchlist to be reminded of HK:2291's next dividend payment.
Does LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H have sufficient earnings to cover their dividend?
Yes, HK:2291's past year earnings per share was HK$0.67, and their annual dividend per share is HK$0.62. HK:2291's dividend payout ratio is 91.68% (HK$0.62/HK$0.67) which is sustainable.