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LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H (HK:2291)
HKEX:2291
Hong Kong Market
2291
LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H
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LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H (2291) Dividend Date & History

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Dividend Data

Last Ex-Dividend Date
May 28, 2024
Payment date​
Jul 22, 2024
Dividend Amount Per Share
HK$0.617
Notavailable
Dividend Yield
3.52%
Sector: Healthcare
Sector Average: 1.643%
Payout Ratio
91.68%
Dividend Growth​
7 months
Since 2024
Last 3 Months

Dividend Amount Per Share​

2291 Dividend Yield Range

Currently, no data available
Please return soon. This page is being updated.

2291 Dividend History

Ex-Date
Record Date
Payment Date
Frequency
Declaration Date
Amount
May 28, 2024May 29, 2024Jul 22, 2024Not AvailableMar 28, 2024HK$0.62
The table shows LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H’s dividend history, including amount per share, payout frequency, declaration, record, and payment dates.

FAQ

Does LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H pay dividends?
Yes, HK:2291 has paid a dividend within the past 12 months.
    How much is LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H's dividend?
    HK:2291 pays a dividend of HK$0.617 per share. HK:2291's annual dividend yield is 3.52%.
      When is LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H ex-dividend date?
      LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H's previous ex-dividend date was on May 28, 2024. LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H shareholders who own HK:2291 stock before this date received LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H's last dividend payment of HK$0.62 per share on Jul 22, 2024. HK:2291's next ex-dividend date has not been announced yet.
        When is LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H dividend payment date?
        LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H’s next quarterly payment date is on Jul 22, 2024, when LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H shareholders who owned HK:2291 shares before May 28, 2024 received a dividend payment of HK$0.62 per share. Add HK:2291 to your watchlist to be reminded of HK:2291's next dividend payment.
          Does LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H have sufficient earnings to cover their dividend?
          Yes, HK:2291's past year earnings per share was HK$0.67, and their annual dividend per share is HK$0.62. HK:2291's dividend payout ratio is 91.68% (HK$0.62/HK$0.67) which is sustainable.
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