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LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H (HK:2291)
HKEX:2291
LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H (2291) Dividend Date & History
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Dividend Data
Last Ex-Dividend Date
May 28, 2024Payment date
Sep 30, 2024
Sep 30, 2024
Dividend Amount Per Share
HK$0.62Notavailable
Dividend Yield
3.18%Sector: Healthcare
Sector Average: 1.499%
Sector Average: 1.499%
Payout Ratio
N/ADividend Growth
last monthSince 2024
Last 3 Months
2291 Dividend Yield Range
Currently, no data available
Please return soon. This page is being updated.
2291 Dividend History
Ex-Date | Amount | Frequency | Declaration Date | Record Date | Payment Date |
|---|---|---|---|---|---|
| May 28, 2024 | HK$0.62 | Not Available | Mar 28, 2024 | May 29, 2024 | Sep 30, 2024 |
FAQ
Does LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H pay dividends?
Yes, HK:2291 has paid a dividend within the past 12 months.
How much is LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H's dividend?
HK:2291 pays a dividend of HK$0.62 per share. HK:2291's annual dividend yield is 3.18%.
When is LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H ex-dividend date?
LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H's upcoming ex-dividend date is on May 28, 2024. LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H shareholders who own HK:2291 stock before this date will receive LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H's next dividend payment of HK$0.62 per share on Sep 30, 2024. Add HK:2291 to your watchlist to be reminded before LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H's ex-dividend date.
When is LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H dividend payment date?
LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H’s next quarterly payment date is on Sep 30, 2024, when LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H shareholders who owned HK:2291 shares before May 28, 2024 received a dividend payment of HK$0.62 per share. Add HK:2291 to your watchlist to be reminded of HK:2291's next dividend payment.
Does LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H have sufficient earnings to cover their dividend?
LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. Class H (HK:2291) does not pay a dividend.