tiprankstipranks
Time Interconnect Technology Limited (HK:1729)
HKEX:1729
Hong Kong Market

Time Interconnect Technology Limited (1729) Dividend Date & History

0 Followers

Dividend Data

Last Ex-Dividend Date
May 31, 2024
Payment date​
Jun 28, 2024
Dividend Amount Per Share
<HK$0.01
Annually
Dividend Yield
0.39%
Sector: Industrial Goods
Sector Average: 1.639%
Payout Ratio
14.10%
Dividend Growth​
2 years
Since 2022
Last 3 Months

Dividend Amount Per Share​

1729 Dividend Yield Range

1729 Dividend History

Ex-Date
Amount
Frequency
Declaration Date
Record Date
Payment Date
May 31, 2024<HK$0.01AnnuallyJun 03, 2024Jun 28, 2024
Dec 08, 2023<HK$0.01AnnuallyNov 27, 2023Dec 11, 2023Jan 09, 2024
Aug 30, 2023<HK$0.01AnnuallyJun 28, 2023Aug 31, 2023Sep 26, 2023
Dec 12, 2022<HK$0.01AnnuallyNov 29, 2022Dec 13, 2022Jan 11, 2023
Aug 25, 2022<HK$0.01AnnuallyJun 28, 2022Aug 26, 2022Sep 22, 2022
Dec 10, 2021<HK$0.01AnnuallyNov 29, 2021Dec 13, 2021Jan 07, 2022
Aug 25, 2021HK$0.01AnnuallyJun 28, 2021Aug 26, 2021Sep 21, 2021
Dec 10, 2020HK$0.01AnnuallyNov 27, 2020Dec 11, 2020Jan 08, 2021
Sep 01, 2020HK$0.01AnnuallyJun 23, 2020Sep 02, 2020Sep 25, 2020
Dec 06, 2019<HK$0.01AnnuallyNov 25, 2019Dec 09, 2019Jan 07, 2020
The table shows Time Interconnect Technology Limited’s dividend history, including amount per share, payout frequency, declaration, record, and payment dates.

FAQ

Does Time Interconnect Technology Limited pay dividends?
Yes, HK:1729 has paid a dividend within the past 12 months.
    How much is Time Interconnect Technology Limited's dividend?
    HK:1729 pays a dividend of <HK$0.01 per share. HK:1729's annual dividend yield is 0.39%.
      When is Time Interconnect Technology Limited ex-dividend date?
      Time Interconnect Technology Limited's previous ex-dividend date was on May 31, 2024. Time Interconnect Technology Limited shareholders who own HK:1729 stock before this date received Time Interconnect Technology Limited's last dividend payment of <HK$0.01 per share on Jun 28, 2024. HK:1729's next ex-dividend date has not been announced yet.
        When is Time Interconnect Technology Limited dividend payment date?
        Time Interconnect Technology Limited’s next quarterly payment date is on Jun 28, 2024, when Time Interconnect Technology Limited shareholders who owned HK:1729 shares before May 31, 2024 received a dividend payment of <HK$0.01 per share. Add HK:1729 to your watchlist to be reminded of HK:1729's next dividend payment.
          Does Time Interconnect Technology Limited have sufficient earnings to cover their dividend?
          Yes, HK:1729's past year earnings per share was HK$0.14, and their annual dividend per share is HK$0.01. HK:1729's dividend payout ratio is 14.10% (HK$0.01/HK$0.14) which is sustainable.
            What's Included in PREMIUM?
            Make informed decisions based on Top Analysts' activity
            Know what industry insiders are buying
            Get actionable alerts from top Wall Street Analysts
            Find out before anyone else which stock is going to shoot up
            Get powerful stock screeners & detailed portfolio analysis