Onto Innovation opens PACE facility in Massachusetts

Onto Innovation announced the opening of the company’s Packaging Applications Center of Excellence, or PACE, a facility in the U.S. dedicated to panel-level packaging innovations enabling 2.5D and 3D chiplet architectures and AI packages. Collaborating partners represent key process steps across the supply chain, ranging from panel package and IC substrate manufacturers to process equipment and material suppliers. Located at Onto‘s Wilmington, Massachusetts, headquarters, PACE offers collaborators and customers access to Onto’s JetStep X500 glass panel handling lithography system, next generation lens technology for glass substrates capable of sub-1.5microm line/space imaging with shot sizes of 141mm x 141mm, and the Discover Command Center.