Micron breaks ground on new high-bandwidth memory facility in SIngapore

Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore. The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with expansion of Micron’s total advanced packaging capacity beginning in calendar 2027 to meet the demands of AI growth. Micron’s HBM advanced packaging investment of approximately $7B through the end of the decade and beyond will initially create around 1,400 jobs, with site expansion plans to reach an estimated 3,000 jobs in the future. These new roles will include functions such as packaging development, assembly and test operations. Micron’s future expansion plans in Singapore will also support long-term manufacturing requirements for NAND. Micron will maintain flexibility in managing the pace of capacity ramps in both the HBM and NAND facilities to align with market demand.