Micron (MU) announced it is the world’s first and only memory company shipping both HBM3E and small outline compression attached memory module products for AI servers in the data center. Micron’s SOCAMM, a modular LPDDR5X memory solution, was developed in collaboration with Nvidia (NVDA) to support the Nvidia GB300 Grace Blackwell Ultra Superchip. The Micron HBM3E 12H 36GB is also designed into the Nvidia HGX B300 NVL16 and GB300 NVL72 platforms, while the HBM3E 8H 24GB is available for the Nvidia HGX B200 and GB200 NVL72 platforms. The deployment of Micron HBM3E products is in Nvidia Hopper and Nvidia Blackwell systems.
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