Lantronix announces Teledyne FLIR thermal integration

Lantronix (LTRX) announced a breakthrough in AI-powered camera technology with the seamless of its high-performance Open-Q System-on-Module solutions including hardware and software with Teledyne FLIR’s thermal infrared camera modules and Prism embedded software. This integration accelerates the development of next-generation AI-enabled camera solutions in autonomous navigation/drones, surveillance and robotics. The company said, “Powered by Lantronix’s cutting-edge Open-Q SoMs, based on the Qualcomm Dragonwing(TM) QRB5165 and QCS8250 processor platforms, this solution delivers unparalleled processing capabilities for AI-driven situational awareness, advanced computational imaging and real-time decision-making. Lantronix’s seamless technology integration provides a competitive edge, enabling developers to create high-performance, size-, weight- and power-optimized (SWaP) AI camera solutions that push the boundaries of innovation.”