GCT Semiconductor signs pact with European tier one wireless provider

GCT Semiconductor (GCTS) announced the signing of a definitive agreement with a European tier one wireless infrastructure and terminal provider to collaborate on the development of Fixed Wireless Access technology using GCT’s 5G solutions including modem chipset and RFIC. The company previously announced the signing of an MOU with the Tier One Supplier in August 2024, a continuation of an existing key customer relationship now moving to 5G. GCT expects the launch of FWA devices related to this activity to commence in the second half of 2025.