Flex, JetCool announce partnership to address demand for AI servers

JetCool and Flex announced a partnership to address the growing demand for AI servers and high-density compute from hyperscalers and enterprise customers. The companies are building rack-level solutions, including a new line of co-designed liquid cooling-ready servers that are compliant with Open Compute Project, or OCP, specification. The new servers leverage JetCool’s patented microconvective liquid cooling technology that uses precision jets to target and cool processor hot spots. This precision cooling manages the increased heat from high-performance AI and compute workloads, ensuring optimal performance and reliability. Additionally, these liquid-cooled servers provide a versatile platform for hyperscalers to design customized AI chip architectures and tailored server configurations to meet unique performance requirements.