Adeia enters into license agreement with Hamamatsu Photonics

Adeia “announced that Hamamatsu Photonics K.K., a pioneer in optical sensors, light sources and systems, has signed a new license for Adeia’s semiconductor intellectual property portfolio covering die-to-wafer hybrid bonding. This new license supplements Hamamatsu’s existing license to Adeia’s DBI(R) wafer-to-wafer hybrid bonding and ZiBond(R) wafer-to-wafer direct bonding technologies and follows from a prior development license between the parties that included a DBI Ultra(R) die-to-wafer hybrid bonding technology transfer.”