ACM Research: PEALD furnace tool achieved process qualification in China

ACM Research (ACMR) announced the qualification of its Ultra Fn A Plasma-Enhanced Atomic Layer Deposition or PEALD, Furnace tool. The tool has achieved process qualification at a mainland China semiconductor customer, and is now entering mass production. ACM also announced that its Ultra Fn A Thermal Atomic Layer Deposition, Thermal ALD, Furnace tool, introduced in 2022, has successfully completed process qualification with another leading mainland China customer, demonstrating performance parameters that it believes match or exceed competitive tools.”Modern integrated circuit IC manufacturing increasingly relies on the deposition of ultra-thin films with excellent step coverage and high quality,” said Dr. David Wang, ACM’s President and Chief Executive Officer. “Addressing the complexity of depositing materials such as silicon carbon nitride, silicon nitride films, and low-k film requires true innovation, and ACM’s R&D team has delivered with its ALD platforms and processes. We believe ACM’s proprietary design is differentiated from other suppliers and enables us to address challenges faced in advanced 3D structure manufacturing.”