Taiwan Semiconductor Manufacturing (TSM) has released an update.
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Taiwan Semiconductor Manufacturing Company (TSMC) has announced the groundbreaking of its first semiconductor fabrication plant in Dresden, Germany, in collaboration with Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. The new fab, operated by the joint venture European Semiconductor Manufacturing Company (ESMC), is set to bolster the EU’s semiconductor production capacity with a monthly output of 40,000 300mm wafers using advanced FinFET technology. This strategic move, supported by a €5 billion German state aid approved by the EU, aims to enhance Europe’s technological capabilities and economic growth, generating approximately 2,000 direct high-tech jobs and promoting sustainability with energy-efficient construction and LEED certification.
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