Tower (TSEM) has released an update.
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Tower Semiconductor, in partnership with Broadcom, has announced the production of Wi-Fi 7 RF front-end modules using its advanced 300mm RFSOI technology, setting a new standard for mobile connectivity performance and efficiency. This collaboration has produced fully integrated, high-performance Wi-Fi FEM devices on a single die, promising enhanced performance for next-generation mobile applications. Tower’s RFSOI technology platform is now recognized for its superior switch and LNA performance, with widespread industry adoption.
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