Ensilica PLC (GB:ENSI) has released an update.
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EnSilica PLC, a prominent ASIC chip maker, has secured a decade-long contract with SIAE Microelettronica to design Application-Specific Integrated Circuits for next-gen telecommunication infrastructure, aiming to advance beyond 5G technology. This strategic partnership is set to bolster EnSilica’s position in the market by leveraging their expertise in RF and communications, while providing SIAE with cutting-edge, power-efficient ASICs. The collaboration is a key part of SIAE’s growth strategy and its involvement in the European IPCEI EMISPHERE project for advancing microelectronics and communication tech.
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