tiprankstipranks
Besi Announces €350M Bond Offering Details
Company Announcements

Besi Announces €350M Bond Offering Details

BE Semiconductor (GB:0XVE) has released an update.

BE Semiconductor Industries N.V. (Besi) has announced the pricing of a €350 million bond offering with a 4.500% coupon, set to close on July 17, 2024. The proceeds are intended for general corporate purposes, including potential acquisitions. The offering, in the form of Senior Notes due 2031, targets qualified institutional buyers in the United States and non-U.S. persons in offshore transactions.

For further insights into GB:0XVE stock, check out TipRanks’ Stock Analysis page.

Related Articles
TipRanks European Auto-Generated NewsdeskBE Semiconductor to Discuss Q2 2024 Earnings
TipRanks European Auto-Generated NewsdeskBE Semiconductor Advances Share Buyback Plan
Looking for investment ideas? Subscribe to our Smart Investor newsletter for weekly expert stock picks!
Optimize your mobile reading experience. Download the TipRanks App today!